TY - GEN
T1 - Real time observation of nanoscale multiple conductive filaments in RRAM by using advanced in-situ TEM
AU - Sun, J.
AU - Wu, X.
AU - Liu, Q.
AU - Liu, M.
AU - Sun, L. T.
PY - 2013
Y1 - 2013
N2 - In this letter, we dynamically investigate the resistive switching characteristics and physical mechanism of the ZrO2-based device. Using in-situ transmission electron microscopy, we observe in real time that multiple conductive filaments (CFs) are formed across the ZrO2 layer between top electrode and bottom electrodes after forming. Various top electrode materials have been used, such as Cu, Ag, and Ni. Contrary to common belief, it is found that CF growth begins at the anode, rather than having to reach the cathode and grow backwards. Energy-dispersive X-ray spectroscopy results confirm that metal from the top electrode is the main composition of the CFs.
AB - In this letter, we dynamically investigate the resistive switching characteristics and physical mechanism of the ZrO2-based device. Using in-situ transmission electron microscopy, we observe in real time that multiple conductive filaments (CFs) are formed across the ZrO2 layer between top electrode and bottom electrodes after forming. Various top electrode materials have been used, such as Cu, Ag, and Ni. Contrary to common belief, it is found that CF growth begins at the anode, rather than having to reach the cathode and grow backwards. Energy-dispersive X-ray spectroscopy results confirm that metal from the top electrode is the main composition of the CFs.
KW - Transmission electron microscopy (TEM)
KW - conductive filaments
KW - in-situ
KW - resistive random access memory
UR - https://www.scopus.com/pages/publications/84885652478
U2 - 10.1109/IPFA.2013.6599223
DO - 10.1109/IPFA.2013.6599223
M3 - 会议稿件
AN - SCOPUS:84885652478
SN - 9781479912414
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
SP - 560
EP - 562
BT - Proceedings of the 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2013
T2 - 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2013
Y2 - 15 July 2013 through 19 July 2013
ER -