RC Tightened Corner Test structure Design and Silicon Characterization in FinFET Technology

  • Lijie Sun*
  • , Mengying Zhang
  • , Guangxing Wan
  • , Waisum Wong
  • , Zhen Zhou
  • , Xiaojin Li
  • , Yabin Sun
  • , Yanling Shi
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, we propose a novel RC tightened corner test structure for FinFET Technology. In this test structure, Parasitic RC DUTs (Design Under Test) integrated into RO (Ring Oscillator) have been designed to verify and calibrate MEOL (Mid-End-Of-Line) and BEOL (Back-End-Of-Line) RC tightened corner; On the other hands, addressable-Array circuit has been used to avoid noise induced by the local variation of FEOL (Front-End-Of-Line) transistors. By the test structure silicon data, RC tightened corners generated from statistical simulation have been iterated and updated.

Original languageEnglish
Title of host publication2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
EditorsShaofeng Yu, Xiaona Zhu, Ting-Ao Tang
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728162355
DOIs
StatePublished - 3 Nov 2020
Event15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Virtual, Kunming, China
Duration: 3 Nov 20206 Nov 2020

Publication series

Name2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings

Conference

Conference15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020
Country/TerritoryChina
CityVirtual, Kunming
Period3/11/206/11/20

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