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Rapid thermal processing of Bi2Ti2O7 thin films grown by chemical solution decomposition

  • Shao Wei Wang*
  • , Hong Wang
  • , Xianming Wu
  • , Shuxia Shang
  • , Min Wang
  • , Zhifeng Li
  • , Wei Lu
  • *Corresponding author for this work
  • CAS - Shanghai Institute of Technical Physics
  • Shandong University

Research output: Contribution to journalArticlepeer-review

Abstract

Bi2Ti2O7 thin films were successfully prepared on n-type Si(100) substrate by using chemical solution decomposition (CSD) technique followed by rapid thermal annealing (RTA). The structural properties were studied by X-ray diffraction (XRD) and atomic force microscopy (AFM). The dielectric properties of the films were evaluated. The leakage current density of Bi2Ti2O7 thin films is of the order of 10-7A/cm2 when the applied voltage is between -18 and +18V. It is much lower than that of films treated by normal thermal processing. The dielectric constant varies from 159 to 150 within the frequency range of 10-100KHz, while the dissipation factor is lower than 0.02 in this range.

Original languageEnglish
Pages (from-to)323-326
Number of pages4
JournalJournal of Crystal Growth
Volume224
Issue number3-4
DOIs
StatePublished - Apr 2001
Externally publishedYes

Keywords

  • A3. Polycrystalline deposition
  • B1. Bismuth compounds
  • B2. Dielectric materials

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