Passivation and stability of thermal atomic layer deposited Al2O3 on CZ-Si

  • Yue He*
  • , Ya Nan Dou
  • , Xiao Guang Ma
  • , Shao Bin Chen
  • , Jun Hao Chu
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Atomic layer deposited (ALD) aluminum oxide (Al2O3) has been known as an almost-perfect candidate of passivation dielectric layer for PERC-type c-Si solar cell. Its passivation performance and thermal stability are key issues for industrial PERC c-Si solar cell based on screen-printed technology. In this paper, 20 nm and 30 nm Al2O3 films are synthesized on the solar grade CZ-Si by thermal atomic layer deposition. The results show that the effective lifetime can reach 100 μs for CZ-Si after annealing and is kept a half after the sintering process in the industrial beltline furnace, and the materials can be used in PERC-type solar cell. The SEM image demonstrates that the blisters occur in a thicker Al2O3 film, which explains why the passivation and thermal stability of 30 nm film are inferior to those of 20 nm film.

Original languageEnglish
Article number248102
JournalWuli Xuebao/Acta Physica Sinica
Volume61
Issue number24
StatePublished - 20 Dec 2012
Externally publishedYes

Keywords

  • AlO
  • Surface passivation
  • Thermal atomic layer deposition
  • c-Si solar cell

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