Abstract
We propose the use of high-oxygen-solubility metalgate electrodes as a material of choice for high- κ gate stacks in order to prolong the time-dependent-dielectric-breakdown (BD) reliability. Our findings on n-channel metaloxidesemiconductor devices with these gate electrodes reveal that the application of low negative bias stress after a soft-BD (SBD) event helps to restore the oxygen ions and passivate the oxygen vacancy traps that comprise the percolation path. This can be a simple yet effective designfor-reliability tool to initiate the self-repair of the percolation path and operate the circuit for a prolonged period after repair. The only requirement for achieving this SBD reversibility is to choose gate electrodes that can serve as good oxygen reservoirs.
| Original language | English |
|---|---|
| Article number | 5680690 |
| Pages (from-to) | 252-254 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 32 |
| Issue number | 3 |
| DOIs | |
| State | Published - Mar 2011 |
| Externally published | Yes |
Keywords
- Design for reliability (DFR)
- high-κ (HK)
- oxygen vacancy
- percolation
- soft breakdown (SBD)
- solubility
- time dependent dielectric breakdown (TDDB)