Oxygen-soluble gate electrodes for prolonged high-κ gate-stack reliability

  • Nagarajan Raghavan*
  • , Kin Leong Pey
  • , Xing Wu
  • , Wenhu Liu
  • , Xiang Li
  • , Michel Bosman
  • , Thomas Kauerauf
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Abstract

We propose the use of high-oxygen-solubility metalgate electrodes as a material of choice for high- κ gate stacks in order to prolong the time-dependent-dielectric-breakdown (BD) reliability. Our findings on n-channel metaloxidesemiconductor devices with these gate electrodes reveal that the application of low negative bias stress after a soft-BD (SBD) event helps to restore the oxygen ions and passivate the oxygen vacancy traps that comprise the percolation path. This can be a simple yet effective designfor-reliability tool to initiate the self-repair of the percolation path and operate the circuit for a prolonged period after repair. The only requirement for achieving this SBD reversibility is to choose gate electrodes that can serve as good oxygen reservoirs.

Original languageEnglish
Article number5680690
Pages (from-to)252-254
Number of pages3
JournalIEEE Electron Device Letters
Volume32
Issue number3
DOIs
StatePublished - Mar 2011
Externally publishedYes

Keywords

  • Design for reliability (DFR)
  • high-κ (HK)
  • oxygen vacancy
  • percolation
  • soft breakdown (SBD)
  • solubility
  • time dependent dielectric breakdown (TDDB)

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