Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes

Z. J. Zhang, Q. Li, Z. Y. Dong, W. T. Wang, S. T. Lai, X. Yang, F. Liang, C. L. Wang, C. Luo, L. J. Lyu, Z. Li, J. M. Xu, X. Wu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The development of integrated circuits greatly enhances brain-computer interface technology. The degradation of the implanted neural electrodes is a key issue. The scanning electron microscope and energy dispersive spectrometer techniques are used to characterize the evolution of the microscopic morphology and element migration of implanted microwire electrodes containing 32 channels together with the recorded neural signals at different implantation times. The spike amplitude decreases over time of implantation, leading to poorer identification of neural signals. The effect of degradation on the local field potential detection is neglectable. This work could guide the reliability improvement of the neural electrodes.

Original languageEnglish
Title of host publication2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665456722
DOIs
StatePublished - 2023
Event61st IEEE International Reliability Physics Symposium, IRPS 2023 - Monterey, United States
Duration: 26 Mar 202330 Mar 2023

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2023-March
ISSN (Print)1541-7026

Conference

Conference61st IEEE International Reliability Physics Symposium, IRPS 2023
Country/TerritoryUnited States
CityMonterey
Period26/03/2330/03/23

Keywords

  • Electron Microscope
  • Failure Mechanism
  • Neural Electrode
  • Reliability

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