Abstract
Metal-induced solid-phase crystallization of amorphous TiO 2 thin films was investigated by introducing metal contact layers such as Ni or Cu between the TiO 2 film and substrate. The crystallization temperature of TiO 2 was found to be lowered by 30 °C (from ∼250 to ∼220 °C) with the use of a Ni contact layer. Based on the fact that part of the Ni atoms diffused to the surface of the crystallized TiO 2 film, we proposed a reaction-assisted crystallization model in which an intermediate complex containing Ti-O and Ni-O bonds decomposes to crystallize TiO 2 at a relatively low temperature.
| Original language | English |
|---|---|
| Article number | 052101 |
| Journal | Applied Physics Letters |
| Volume | 101 |
| Issue number | 5 |
| DOIs | |
| State | Published - 30 Jul 2012 |
| Externally published | Yes |