Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

X. P. Li; Z. J. Zhao; H. L. Seet; W. M. Heng; T. B. Oh; J. Y. Lee

doi:10.1149/1.1625593

Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

X. P. Li^*
, Z. J. Zhao
, H. L. Seet
, W. M. Heng
, T. B. Oh
, J. Y. Lee

^*Corresponding author for this work

National University of Singapore

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

The effects of magnetic field on the plating material in magnetically controlled electroplating is investigated for the fabrication of microcomposite wire used in magnetoimpedance sensing elements. Composite wires of microcopper core plated with a layer of ferromagnetic material, NiFe, are produced by electroplating with and without an external magnetic field longitudinal to the wire. The results show that the presence of a magnetic field during plating enhances the NiFe composition ratio along the plated surface, and enhances the alignment of crystal grains of the plated material and the smoothness of the plated surface. The imposed external magnetic field modifies the magnetic anisotropy of the plated layer from circumferential to longitudinal.

Original language	English
Pages (from-to)	C1-C3
Journal	Electrochemical and Solid-State Letters
Volume	7
Issue number	1
DOIs	https://doi.org/10.1149/1.1625593
State	Published - 2004
Externally published	Yes

Access to Document

10.1149/1.1625593

Cite this

@article{c12ccb4fb0674bd9b6299bd7307cee06,

title = "Magnetically Controlled Electroplating of NiFe/Cu Composite Wires",

abstract = "The effects of magnetic field on the plating material in magnetically controlled electroplating is investigated for the fabrication of microcomposite wire used in magnetoimpedance sensing elements. Composite wires of microcopper core plated with a layer of ferromagnetic material, NiFe, are produced by electroplating with and without an external magnetic field longitudinal to the wire. The results show that the presence of a magnetic field during plating enhances the NiFe composition ratio along the plated surface, and enhances the alignment of crystal grains of the plated material and the smoothness of the plated surface. The imposed external magnetic field modifies the magnetic anisotropy of the plated layer from circumferential to longitudinal.",

author = "Li, \{X. P.\} and Zhao, \{Z. J.\} and Seet, \{H. L.\} and Heng, \{W. M.\} and Oh, \{T. B.\} and Lee, \{J. Y.\}",

year = "2004",

doi = "10.1149/1.1625593",

language = "英语",

volume = "7",

pages = "C1--C3",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society Inc.",

number = "1",

}

TY - JOUR

T1 - Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

AU - Li, X. P.

AU - Zhao, Z. J.

AU - Seet, H. L.

AU - Heng, W. M.

AU - Oh, T. B.

AU - Lee, J. Y.

PY - 2004

Y1 - 2004

N2 - The effects of magnetic field on the plating material in magnetically controlled electroplating is investigated for the fabrication of microcomposite wire used in magnetoimpedance sensing elements. Composite wires of microcopper core plated with a layer of ferromagnetic material, NiFe, are produced by electroplating with and without an external magnetic field longitudinal to the wire. The results show that the presence of a magnetic field during plating enhances the NiFe composition ratio along the plated surface, and enhances the alignment of crystal grains of the plated material and the smoothness of the plated surface. The imposed external magnetic field modifies the magnetic anisotropy of the plated layer from circumferential to longitudinal.

AB - The effects of magnetic field on the plating material in magnetically controlled electroplating is investigated for the fabrication of microcomposite wire used in magnetoimpedance sensing elements. Composite wires of microcopper core plated with a layer of ferromagnetic material, NiFe, are produced by electroplating with and without an external magnetic field longitudinal to the wire. The results show that the presence of a magnetic field during plating enhances the NiFe composition ratio along the plated surface, and enhances the alignment of crystal grains of the plated material and the smoothness of the plated surface. The imposed external magnetic field modifies the magnetic anisotropy of the plated layer from circumferential to longitudinal.

UR - https://www.scopus.com/pages/publications/0942288686

U2 - 10.1149/1.1625593

DO - 10.1149/1.1625593

M3 - 文章

AN - SCOPUS:0942288686

SN - 1099-0062

VL - 7

SP - C1-C3

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

IS - 1

ER -

Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

Abstract

Access to Document

Other files and links

Fingerprint

Cite this