Investigation on Enhanced Hot Carrier Degradation in FinFETs at Cryogenic Temperature

Zirui Wang, Zuoyuan Dong, Hongbo Wang, Zixuan Sun, Yue Yang Liu, Xing Wu, Runsheng Wang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, we investigate the enhanced hot carrier degradation (HCD) in FinFET at cryogenic temperatures. Under comparable stress condition, significantly enhanced Vth degradation than room temperature HCD is observed for cryogenic HCD, which can be successfully explained by three main factors: (a) Ge element migration from the drain migrates into the channel and reduce the band tail states under cryogenic HCD in pFinFET (b) Fermi levels moves closer to the band edge which increase the occupation of interface traps and amplify Δ Vth. (c) The enhancement of ballistic transport results in more high energy carrier, consequently accelerating the interface trap generation rate. This work reveals the impacts of cryogenic physics on HCD and provides insights into the cryogenic reliability analysis.

Original languageEnglish
Title of host publication2025 Silicon Nanoelectronics Workshop, SNW 2025
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages118-119
Number of pages2
ISBN (Electronic)9784863488168
DOIs
StatePublished - 2025
Event2025 Silicon Nanoelectronics Workshop, SNW 2025 - Kyoto, Japan
Duration: 8 Jun 20259 Jun 2025

Publication series

Name2025 Silicon Nanoelectronics Workshop, SNW 2025

Conference

Conference2025 Silicon Nanoelectronics Workshop, SNW 2025
Country/TerritoryJapan
CityKyoto
Period8/06/259/06/25

Fingerprint

Dive into the research topics of 'Investigation on Enhanced Hot Carrier Degradation in FinFETs at Cryogenic Temperature'. Together they form a unique fingerprint.

Cite this