Influence of Gate-Drain Underlap Length on Germanium Gate-All-Around Tunneling Field-Effect-Transistors

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the influence of gate-drain underlap length (Lun) of germanium gate-all-around tunneling field-effect-transistors (Ge-GAA- TFETs) is investigated. Based on the TCAD simulation, the I- V and C- V characteristics of GAA- TFETs with different Lunare obtained, and the results show that ambipolar current (Iamp) and Cgd considerably decrease with the increase in Lun, whereas Cgs is independent on Lun. Moreover, the method of device circuit co-design is used to evaluate the impact of Lunon logic performance including propagation delay (tpd) and energy-delay-product (EDP). Compared with no underlap structure, the tpd reduction of 40% @VDD= 0.2 V is achieved in both inverter and two-input NAND with 10 nm underlap structure. The EDP reduction up to 67% and 66% at VDD= 0.2 V are obtained in the inverter and two-input NAND, respectively. Therefore, we can conclude that the longer Lunbenefits in mitigating both tpd and EDP.

Original languageEnglish
Title of host publication2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
EditorsShaofeng Yu, Xiaona Zhu, Ting-Ao Tang
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728162355
DOIs
StatePublished - 3 Nov 2020
Event15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Virtual, Kunming, China
Duration: 3 Nov 20206 Nov 2020

Publication series

Name2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings

Conference

Conference15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020
Country/TerritoryChina
CityVirtual, Kunming
Period3/11/206/11/20

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