@inproceedings{beedbcb1e071454caea1592de2bb75e6,
title = "In-situ TEM observation of IMC evolution at atomic scale",
abstract = "The formation mechanism of Cu-Al IMC is critical to control the contact quality of interconnections between Al bond pads and Cu wires. The in-situ TEM is a powerful tool to analyze the phase evolution and defects formation of IMC in real time. TEM images reveals that the amount of IMC increases with raising of annealing temperature and duration of time. Energy dispersive spectrometer (EDX) and high resolution TEM (HRTEM) demonstrate that the IMC is composed of CuAl2, CuAl, and Cu9Al4.",
author = "Chaolun Wang and Xing Wu",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 China Semiconductor Technology International Conference, CSTIC 2017 ; Conference date: 12-03-2017 Through 13-03-2017",
year = "2017",
month = may,
day = "4",
doi = "10.1109/CSTIC.2017.7919868",
language = "英语",
series = "China Semiconductor Technology International Conference 2017, CSTIC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Steve Liang and Ying Shi and Ru Huang and Qinghuang Lin and David Huang and Hanming Wu and Yuchun Wang and Cor Claeys and Kafai Lai and Ying Zhang and Peilin Song and Viyu Shi and Zhen Guo",
booktitle = "China Semiconductor Technology International Conference 2017, CSTIC 2017",
address = "美国",
}