@inproceedings{721b0832efe74dbf8be25cfb0d522641,
title = "In Situ Localization Techniques of Defects in Advanced Semiconductor Devices from Macro-Scale to Atomistic-Scale",
abstract = "As manufacturing processes for advanced semiconductor devices become more complex, precise defect localization and characterization are crucial for device failure analysis and reliability improvement. This review summarizes in situ defects localization methods across different scales. Specifically, it covers defect detection techniques from macroscopic level (such as EFA) to microscopic level (such as FIB-SEM and CR technique), even down to atomic level (typically TEM). Also, corresponding research findings are presented. These techniques provide significant support and assistance for developing advanced semiconductor devices.",
keywords = "In situ defect localization, advanced semiconductor devices, infrared detector",
author = "Jialu Huang and Jingming Zhou and Zuoyuan Dong and Runsheng Wang and Junhao Chu and Xing Wu",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 17th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2024 ; Conference date: 22-10-2024 Through 25-10-2024",
year = "2024",
doi = "10.1109/ICSICT62049.2024.10831395",
language = "英语",
series = "2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Fan Ye and Xiaona Zhu and Tang, \{Ting Ao\}",
booktitle = "2024 IEEE 17th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2024",
address = "美国",
}