Improved heat-dissipating silicone by nano-materials for LED packaging

M. L. Cao; F. Y. Pang; M. C. Zhang; Z. J. Cheng; Y. Gao; P. G. He; L. K. Pan; Z. Sun

doi:10.1109/INEC.2008.4585595

Improved heat-dissipating silicone by nano-materials for LED packaging

M. L. Cao, F. Y. Pang, M. C. Zhang, Z. J. Cheng, Y. Gao, P. G. He, L. K. Pan, Z. Sun

School of Physics and Electronic Science

East China Normal University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

8 Scopus citations

Abstract

Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

Original language	English
Title of host publication	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008
Pages	758-760
Number of pages	3
DOIs	https://doi.org/10.1109/INEC.2008.4585595
State	Published - 2008
Event	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 - Shanghai, China Duration: 24 Mar 2008 → 27 Mar 2008

Publication series

Name	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

Conference

Conference	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008
Country/Territory	China
City	Shanghai
Period	24/03/08 → 27/03/08

Keywords

LED packaging
Nano-diamond
Thermal conductivity

Access to Document

10.1109/INEC.2008.4585595

Cite this

Cao, M. L., Pang, F. Y., Zhang, M. C., Cheng, Z. J., Gao, Y., He, P. G., Pan, L. K., & Sun, Z. (2008). Improved heat-dissipating silicone by nano-materials for LED packaging. In 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 (pp. 758-760). Article 4585595 (2008 2nd IEEE International Nanoelectronics Conference, INEC 2008). https://doi.org/10.1109/INEC.2008.4585595

@inproceedings{fb7d22e95d2d482e93c6f291374b8c7a,

title = "Improved heat-dissipating silicone by nano-materials for LED packaging",

abstract = "Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02\% nano-diamond particles.",

keywords = "LED packaging, Nano-diamond, Thermal conductivity",

author = "Cao, \{M. L.\} and Pang, \{F. Y.\} and Zhang, \{M. C.\} and Cheng, \{Z. J.\} and Y. Gao and He, \{P. G.\} and Pan, \{L. K.\} and Z. Sun",

year = "2008",

doi = "10.1109/INEC.2008.4585595",

language = "英语",

isbn = "9781424415731",

series = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008",

pages = "758--760",

booktitle = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008",

note = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 ; Conference date: 24-03-2008 Through 27-03-2008",

}

Cao, ML, Pang, FY, Zhang, MC, Cheng, ZJ, Gao, Y, He, PG, Pan, LK & Sun, Z 2008, Improved heat-dissipating silicone by nano-materials for LED packaging. in 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008., 4585595, 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008, pp. 758-760, 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008, Shanghai, China, 24/03/08. https://doi.org/10.1109/INEC.2008.4585595

Improved heat-dissipating silicone by nano-materials for LED packaging. / Cao, M. L.; Pang, F. Y.; Zhang, M. C. et al.
2008 2nd IEEE International Nanoelectronics Conference, INEC 2008. 2008. p. 758-760 4585595 (2008 2nd IEEE International Nanoelectronics Conference, INEC 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Improved heat-dissipating silicone by nano-materials for LED packaging

AU - Cao, M. L.

AU - Pang, F. Y.

AU - Zhang, M. C.

AU - Cheng, Z. J.

AU - Gao, Y.

AU - He, P. G.

AU - Pan, L. K.

AU - Sun, Z.

PY - 2008

Y1 - 2008

N2 - Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

AB - Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

KW - LED packaging

KW - Nano-diamond

KW - Thermal conductivity

UR - https://www.scopus.com/pages/publications/52649130368

U2 - 10.1109/INEC.2008.4585595

DO - 10.1109/INEC.2008.4585595

M3 - 会议稿件

AN - SCOPUS:52649130368

SN - 9781424415731

T3 - 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

SP - 758

EP - 760

BT - 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

T2 - 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

Y2 - 24 March 2008 through 27 March 2008

ER -

Improved heat-dissipating silicone by nano-materials for LED packaging

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Keywords

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