Improved heat-dissipating electrical insulator encapsulation gel by micro-diamonds

Micro-diamonds were introduced into electrical insulator encapsulation gel to investigate their Effect on the thermal conductivity. Microstructure studies by a scanning electron microscope showed that The micro-diamonds could be better dispersed in the matrix. No notable phase separation between the micro-diamonds and electrical insulator encapsulation gel matrix were observed. The thermal conductivities of the composites were measured by the Hot Disk Thermal Constants Analyser. The thermal conductivity k was found to increase with the micro-diamonds filler loading. There was a 29.2% enhancement in thermal conductivities for electrical insulator encapsulation gel with 12.5wt% micro-diamonds loading, as compared with 0.24W/m ^* Κ for the pure electrical insulator encapsulation gel.