High temperature creep of a hot-pressed β-sialon

M. T. Lin, J. L. Shi, D. Y. Jiang, M. L. Ruan, T. R. Lai

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

The four-point bending creep properties of a hot-pressed β-sialon with Sm-melilite solid solution (denoted as M′) as intergranular phase have been studied in the temperature range 1250-1350°C in air. Creep rates plotted against stresses gave stress exponents of 1.45, 1.51 and 1.72 at 1250, 1300 and 1350°C, respectively, and Arrhenius plot between creep rate and temperature yielded a creep activation energy of 576 kJ mol-1. Cavities were found to be mainly on the triple grain junctions. Diffusion coupled with grain boundary sliding and accompanied by the formation of wedge-shaped cavities was identified as the dominant creep mechanism.

Original languageEnglish
Pages (from-to)61-67
Number of pages7
JournalMaterials Science and Engineering: A
Volume300
Issue number1-2
DOIs
StatePublished - 28 Feb 2001
Externally publishedYes

Keywords

  • Creep
  • Oxidation
  • β-Sialon

Fingerprint

Dive into the research topics of 'High temperature creep of a hot-pressed β-sialon'. Together they form a unique fingerprint.

Cite this