High-performance transparent conductive film by using ultra-thin metal grids

  • Zhiqin Yin
  • , Qingquan Liu
  • , Zhuangzhuang Cui
  • , Zhiyi Xuan
  • , Maobing Xie
  • , Bimu Yao
  • , Shaowei Wang*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

Transparent conductive films (TCFs) are indispensable for many optoelectronic devices. Films with high transmittance and low sheet resistance at low cost are ideal for people to pursue. In this paper, ultra-thin Au grid TCFs with thickness less than 0.32 μm are developed and fabricated by ultraviolet lithography. Nanoscale thick metal grid and simple experimental steps can greatly reduce their cost. The influence of grid shape (square, hexagon, ring), thickness and duty ratio on the transmittance and sheet resistance has been investigated systematically. The TCF with square shape Au grid has excellent properties with transmittance of 96.9%, sheet resistance of 11.5 ω sq-1, and corresponding figure of merit of 1016. It is a good transparent heater with heating speed 100% faster and heating temperature 3.3% higher than indium tin oxide. It can also be fabricated on flexible substrates and exhibit good mechanical property, which have wide practical applications.

Original languageEnglish
Article number035016
JournalSemiconductor Science and Technology
Volume37
Issue number3
DOIs
StatePublished - Mar 2022
Externally publishedYes

Keywords

  • metal grids
  • transparent conductive film
  • ultra-thin
  • ultraviolet lithography

Fingerprint

Dive into the research topics of 'High-performance transparent conductive film by using ultra-thin metal grids'. Together they form a unique fingerprint.

Cite this