Formation of the copper nano-particles in porous silicon by electroplating

Xiao Feng; Shaohui Xu; Shaoqiang Chen; Jianzhong Zhu; Ziqiang Zhu; Zongsheng Lai

doi:10.1117/12.607806

Formation of the copper nano-particles in porous silicon by electroplating

Xiao Feng^*
, Shaohui Xu
, Shaoqiang Chen
, Jianzhong Zhu
, Ziqiang Zhu
, Zongsheng Lai

^*Corresponding author for this work

School of Communication and Electronic Engineering

East China Normal University

Research output: Contribution to journal › Conference article › peer-review

Abstract

A cheap and simple method of depositing copper into porous silicon by cathode electroplating was described. The existence of cubic copper nano-particles (∼30nm) into porous silicon matrix was verified by X-ray Diffraction and Scanning Electron Microscopy. The microcrystal size of porous silicon and strain between porous silicon and copper layer were discussed based on the Raman spectra.

Original language	English
Article number	131
Pages (from-to)	563-566
Number of pages	4
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	5774
DOIs	https://doi.org/10.1117/12.607806
State	Published - 2005
Event	Fifth International Conference on Thin Film Physics and Applications - Shanghai, China Duration: 31 May 2004 → 2 Jun 2004

Keywords

Cathode electroplating
Copper nano-particles
Porous silicon

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10.1117/12.607806

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title = "Formation of the copper nano-particles in porous silicon by electroplating",

abstract = "A cheap and simple method of depositing copper into porous silicon by cathode electroplating was described. The existence of cubic copper nano-particles (∼30nm) into porous silicon matrix was verified by X-ray Diffraction and Scanning Electron Microscopy. The microcrystal size of porous silicon and strain between porous silicon and copper layer were discussed based on the Raman spectra.",

keywords = "Cathode electroplating, Copper nano-particles, Porous silicon",

author = "Xiao Feng and Shaohui Xu and Shaoqiang Chen and Jianzhong Zhu and Ziqiang Zhu and Zongsheng Lai",

year = "2005",

doi = "10.1117/12.607806",

language = "英语",

volume = "5774",

pages = "563--566",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Fifth International Conference on Thin Film Physics and Applications ; Conference date: 31-05-2004 Through 02-06-2004",

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TY - JOUR

T1 - Formation of the copper nano-particles in porous silicon by electroplating

AU - Feng, Xiao

AU - Xu, Shaohui

AU - Chen, Shaoqiang

AU - Zhu, Jianzhong

AU - Zhu, Ziqiang

AU - Lai, Zongsheng

PY - 2005

Y1 - 2005

N2 - A cheap and simple method of depositing copper into porous silicon by cathode electroplating was described. The existence of cubic copper nano-particles (∼30nm) into porous silicon matrix was verified by X-ray Diffraction and Scanning Electron Microscopy. The microcrystal size of porous silicon and strain between porous silicon and copper layer were discussed based on the Raman spectra.

AB - A cheap and simple method of depositing copper into porous silicon by cathode electroplating was described. The existence of cubic copper nano-particles (∼30nm) into porous silicon matrix was verified by X-ray Diffraction and Scanning Electron Microscopy. The microcrystal size of porous silicon and strain between porous silicon and copper layer were discussed based on the Raman spectra.

KW - Cathode electroplating

KW - Copper nano-particles

KW - Porous silicon

UR - https://www.scopus.com/pages/publications/25644456923

U2 - 10.1117/12.607806

DO - 10.1117/12.607806

M3 - 会议文章

AN - SCOPUS:25644456923

SN - 0277-786X

VL - 5774

SP - 563

EP - 566

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

M1 - 131

T2 - Fifth International Conference on Thin Film Physics and Applications

Y2 - 31 May 2004 through 2 June 2004

ER -

Formation of the copper nano-particles in porous silicon by electroplating

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Keywords

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