@inproceedings{ea18a0f2716a47c3b23b37246878d9e5,
title = "Finite element simulation of Cu-SiO2direct hybrid bonding: Impact of via on bonding integration",
abstract = "In this work, the influence of vias design on hybrid bonding is explored by finite element analysis approach. The impact of via shape, width, depth, and pad dishing on the bonding quality are firstly investigated by taking the copper pad with one via into account. The results indicate that the bonding quality is determined by the via width, depth, and pad dishing, while the via shape is of little influence. Followingly, the simulation about one via design is extended to the via array design. An optimized via array arrangement is achieved with a high contact area ratio and uniform interfacial stress at last. The simulation results in this paper are expected to provide guidelines for optimizing the hybrid bonding process.",
author = "Guoqiang Zhao and Wenzhi Wang and Huimin Zhang and Nan Zhang and Xiaofeng Zhou and Yi Zhao",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 25th Electronics Packaging Technology Conference, EPTC 2023 ; Conference date: 05-12-2023 Through 08-12-2023",
year = "2023",
doi = "10.1109/EPTC59621.2023.10457874",
language = "英语",
series = "Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "359--364",
editor = "Andrew Tay and Chui, \{King Jien\} and Lim, \{Yeow Kheng\} and Tan, \{Chuan Seng\} and Sunmi Shin",
booktitle = "Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023",
address = "美国",
}