Electronegativity equalization model for interface barrier formation at reactive metal/organic contacts

J. X. Tang, Y. Q. Li, S. D. Wang, C. S. Lee, S. T. Lee

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Abstract

A general model based on electronegativity equalization method (EEM) is proposed for a quantitative formulation of barrier formation at reactive metal/organic interfaces. The present model predicts for molecular bonding formation a linear dependence of barrier heights on the degree of partial charge transfer, which is determined by the electronegativity difference between metals and molecules. Also, the calculated barrier heights show good agreement with the empirical values. It suggests that the EEM-based electronegativity model has captured the essence of barrier formation at reactive metal/organic interfaces, and that electronegativity is a fundamental factor in characterizing the chemical trend of barrier heights.

Original languageEnglish
Article number173303
JournalApplied Physics Letters
Volume95
Issue number17
DOIs
StatePublished - 2009
Externally publishedYes

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