Effect of sputtering technology on the microstructure and magnetic properties of Cu/SiO2/Ni80Fe20 composite wires

Xiao Qi Pan; Xin Li; Hai Lin Pan; Qiang Zhao; Jian Zhong Ruan; Xiao Feng Ji; De Lu Chen; Zhen Jie Zhao

doi:10.3969/j.issn.1001-9731.2014.10.021

Effect of sputtering technology on the microstructure and magnetic properties of Cu/SiO₂/Ni₈₀Fe₂₀ composite wires

Xiao Qi Pan, Xin Li, Hai Lin Pan, Qiang Zhao, Jian Zhong Ruan, Xiao Feng Ji, De Lu Chen, Zhen Jie Zhao^*

^*Corresponding author for this work

East China Normal University

Research output: Contribution to journal › Article › peer-review

Abstract

In this work, Cu/SiO₂ and Cu/SiO₂/Ni₈₀Fe₂₀ composite wires were prepared by RF magnetron sputtering on the rotating substrate of Cu. The influence of the rotating rates during sputtering SiO₂ on the microstructure and giant magnetoimpedance (GMI) effect of the composite wires was investigated by the methods of SEM and impedance analyzer. The results showed that with the increase of the rotating rate, the particle size of the film surface first decreased and then increased, while the GMI effect of the Cu/SiO₂/Ni₈₀Fe₂₀ composite wires first increased and then decreased.

Original language	English
Pages (from-to)	10095-10097+10101
Journal	Gongneng Cailiao/Journal of Functional Materials
Volume	45
Issue number	10
DOIs	https://doi.org/10.3969/j.issn.1001-9731.2014.10.021
State	Published - 30 May 2014
Externally published	Yes

Keywords

Composite wires
GMI effect
Grain size
Rotating rate

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10.3969/j.issn.1001-9731.2014.10.021

Cite this

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title = "Effect of sputtering technology on the microstructure and magnetic properties of Cu/SiO2/Ni80Fe20 composite wires",

abstract = "In this work, Cu/SiO2 and Cu/SiO2/Ni80Fe20 composite wires were prepared by RF magnetron sputtering on the rotating substrate of Cu. The influence of the rotating rates during sputtering SiO2 on the microstructure and giant magnetoimpedance (GMI) effect of the composite wires was investigated by the methods of SEM and impedance analyzer. The results showed that with the increase of the rotating rate, the particle size of the film surface first decreased and then increased, while the GMI effect of the Cu/SiO2/Ni80Fe20 composite wires first increased and then decreased.",

keywords = "Composite wires, GMI effect, Grain size, Rotating rate",

author = "Pan, \{Xiao Qi\} and Xin Li and Pan, \{Hai Lin\} and Qiang Zhao and Ruan, \{Jian Zhong\} and Ji, \{Xiao Feng\} and Chen, \{De Lu\} and Zhao, \{Zhen Jie\}",

year = "2014",

month = may,

day = "30",

doi = "10.3969/j.issn.1001-9731.2014.10.021",

language = "英语",

volume = "45",

pages = "10095--10097+10101",

journal = "Gongneng Cailiao/Journal of Functional Materials",

issn = "1001-9731",

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number = "10",

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TY - JOUR

T1 - Effect of sputtering technology on the microstructure and magnetic properties of Cu/SiO2/Ni80Fe20 composite wires

AU - Pan, Xiao Qi

AU - Li, Xin

AU - Pan, Hai Lin

AU - Zhao, Qiang

AU - Ruan, Jian Zhong

AU - Ji, Xiao Feng

AU - Chen, De Lu

AU - Zhao, Zhen Jie

PY - 2014/5/30

Y1 - 2014/5/30

N2 - In this work, Cu/SiO2 and Cu/SiO2/Ni80Fe20 composite wires were prepared by RF magnetron sputtering on the rotating substrate of Cu. The influence of the rotating rates during sputtering SiO2 on the microstructure and giant magnetoimpedance (GMI) effect of the composite wires was investigated by the methods of SEM and impedance analyzer. The results showed that with the increase of the rotating rate, the particle size of the film surface first decreased and then increased, while the GMI effect of the Cu/SiO2/Ni80Fe20 composite wires first increased and then decreased.

AB - In this work, Cu/SiO2 and Cu/SiO2/Ni80Fe20 composite wires were prepared by RF magnetron sputtering on the rotating substrate of Cu. The influence of the rotating rates during sputtering SiO2 on the microstructure and giant magnetoimpedance (GMI) effect of the composite wires was investigated by the methods of SEM and impedance analyzer. The results showed that with the increase of the rotating rate, the particle size of the film surface first decreased and then increased, while the GMI effect of the Cu/SiO2/Ni80Fe20 composite wires first increased and then decreased.

KW - Composite wires

KW - GMI effect

KW - Grain size

KW - Rotating rate

UR - https://www.scopus.com/pages/publications/84903444353

U2 - 10.3969/j.issn.1001-9731.2014.10.021

DO - 10.3969/j.issn.1001-9731.2014.10.021

M3 - 文章

AN - SCOPUS:84903444353

SN - 1001-9731

VL - 45

SP - 10095-10097+10101

JO - Gongneng Cailiao/Journal of Functional Materials

JF - Gongneng Cailiao/Journal of Functional Materials

IS - 10

ER -

Effect of sputtering technology on the microstructure and magnetic properties of Cu/SiO₂/Ni₈₀Fe₂₀ composite wires

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Keywords

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