Effect of magnetic field on the magnetic properties of electroplated NiFe/Cu composite wires

  • X. P. Li*
  • , Z. J. Zhao
  • , H. L. Seet
  • , W. M. Heng
  • , T. B. Oh
  • , J. Y. Lee
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

49 Scopus citations

Abstract

The effects of longitudinal magnetic field on the magnetic properties of the NiFe/Cu composite wire were studied. Wire was fabricated by the electroplating of a 2 μm Ni 80Fe 20 on a Cu wire of 20 μm. Scanning electron microscopy was used to study the thickness and composition was investigated by using energy dispersive X-ray technique. It was found that the presence of the magnetic field enhances the orderly packing of the crystals in the plated layer.

Original languageEnglish
Pages (from-to)6655-6658
Number of pages4
JournalJournal of Applied Physics
Volume94
Issue number10
DOIs
StatePublished - 15 Nov 2003
Externally publishedYes

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