Abstract
TiO x thin-film transistors (TFTs) are fabricated using SiO 2 as gate dielectrics. The enhancement of the electric characteristics is observed after a postannealing processing including the reduction of the threshold voltage V th, the increase in mobility μ, and the on/off ratio. The effect of the postannealing temperature on both the TiO xSiO 2 interfacial bonding structure and the TiO x crystallinity is investigated. We suggest that the interfacial modification at the TiO xSiO 2 interface contributes to the significant reduction of V th due to the breaking of Si-O-Ti bonding. The improvement of the TiO x crystallinity and interfacial structure leads to the increase in μ and in the on/off ratio. The low-temperature annealing treatment at 200 °C is very effective to improve the TiO xSiO 2 interface structure.
| Original language | English |
|---|---|
| Article number | 6199956 |
| Pages (from-to) | 1009-1011 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 33 |
| Issue number | 7 |
| DOIs | |
| State | Published - 2012 |
Keywords
- Annealing
- semiconductor-insulator interfaces
- thin-film transistors (TFTs)
- titanium oxide (TiO )