Effect of annealing temperature on TiO 2-based thin-film-transistor performance

  • Ni Zhong*
  • , Jun Jun Cao
  • , Hisashi Shima
  • , Hiro Akinaga
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Abstract

TiO x thin-film transistors (TFTs) are fabricated using SiO 2 as gate dielectrics. The enhancement of the electric characteristics is observed after a postannealing processing including the reduction of the threshold voltage V th, the increase in mobility μ, and the on/off ratio. The effect of the postannealing temperature on both the TiO xSiO 2 interfacial bonding structure and the TiO x crystallinity is investigated. We suggest that the interfacial modification at the TiO xSiO 2 interface contributes to the significant reduction of V th due to the breaking of Si-O-Ti bonding. The improvement of the TiO x crystallinity and interfacial structure leads to the increase in μ and in the on/off ratio. The low-temperature annealing treatment at 200 °C is very effective to improve the TiO xSiO 2 interface structure.

Original languageEnglish
Article number6199956
Pages (from-to)1009-1011
Number of pages3
JournalIEEE Electron Device Letters
Volume33
Issue number7
DOIs
StatePublished - 2012

Keywords

  • Annealing
  • semiconductor-insulator interfaces
  • thin-film transistors (TFTs)
  • titanium oxide (TiO )

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