@inproceedings{ea37f63106a840218dd2cc4c1ee16546,
title = "Design and fabrication of a micro-electromechanical system sandwich capacitive accelerometer",
abstract = "This paper reports a micro-gravity MEMS sandwich capacitive accelerometer with symmetrical double-sided folded beam-mass structure. The beam-mass structure is fabricated from a single double-device-layer SOI wafer (D-SOI). The fabrication process produced proof mass with though wafer thickness (860μm) to enable formation of a larger proof mass. The suspension system of eight folded beams with highly controllable dimension suspends the proof mass from both sides. A sandwich differential capacitive accelerometer based on symmetrical double-sided folded beams-mass structure is fabricated by three-layer silicon/silicon wafer direct bonding. The resonance frequency of the developed device is measured in an open-loop system by a network analyzer. The quality factor and the resonant frequency are 18 and 830Hz, respectively. The accelerometer has a closed-loop sensitivity of 1.8V/g and a nonlinearity of 0.52\% over the range of 1g.",
author = "Xiaofeng Zhou and Youling Lin and Lufeng Che and Xiaolin Li and Jian Wu and Yuelin Wang",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 ; Conference date: 13-04-2014 Through 16-04-2014",
year = "2014",
month = sep,
day = "23",
doi = "10.1109/NEMS.2014.6908752",
language = "英语",
series = "9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "28--31",
booktitle = "9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014",
address = "美国",
}