TY - GEN
T1 - Curling-PCM
T2 - 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
AU - Liu, Duo
AU - Wang, Tianzheng
AU - Wang, Yi
AU - Shao, Zili
AU - Zhuge, Qingfeng
AU - Sha, Edwin
PY - 2013
Y1 - 2013
N2 - Phase change memory (PCM) has been used as NOR flash replacement in embedded systems with its attractive features. However, the endurance of PCM keeps drifting down and greatly limits its adoption in embedded systems. As most embedded systems are application-oriented, we can better utilize PCM by exploring application-specific features such as fixed access patterns and update frequencies to prolong the lifetime of PCM. In this paper, we propose an application-specific wear leveling technique, called Curling-PCM, to evenly distribute write activities across the PCM chip in order to improve the endurance of PCM. The basic idea is to exploit application-specific features in embedded systems and periodically move the hot region across the whole PCM chip. To further reduce the overhead of moving the hot region and improve the performance of PCM-based embedded systems, a fine-grained partial wear leveling policy is proposed in Curling-PCM, by which only part of the hot region is moved during each request handling period. The experimental results show that Curling-PCM can effectively evenly distribute write traffic in PCM chips compared with previous work. We expect this work can serve as a first step towards the full exploration of application-specific features in PCM-based embedded systems.
AB - Phase change memory (PCM) has been used as NOR flash replacement in embedded systems with its attractive features. However, the endurance of PCM keeps drifting down and greatly limits its adoption in embedded systems. As most embedded systems are application-oriented, we can better utilize PCM by exploring application-specific features such as fixed access patterns and update frequencies to prolong the lifetime of PCM. In this paper, we propose an application-specific wear leveling technique, called Curling-PCM, to evenly distribute write activities across the PCM chip in order to improve the endurance of PCM. The basic idea is to exploit application-specific features in embedded systems and periodically move the hot region across the whole PCM chip. To further reduce the overhead of moving the hot region and improve the performance of PCM-based embedded systems, a fine-grained partial wear leveling policy is proposed in Curling-PCM, by which only part of the hot region is moved during each request handling period. The experimental results show that Curling-PCM can effectively evenly distribute write traffic in PCM chips compared with previous work. We expect this work can serve as a first step towards the full exploration of application-specific features in PCM-based embedded systems.
UR - https://www.scopus.com/pages/publications/84877735839
U2 - 10.1109/ASPDAC.2013.6509609
DO - 10.1109/ASPDAC.2013.6509609
M3 - 会议稿件
AN - SCOPUS:84877735839
SN - 9781467330299
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 279
EP - 284
BT - 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Y2 - 22 January 2013 through 25 January 2013
ER -