Cure kinetics of epoxy resin/MP/anhydride/accelerant flame retardant composite

Yiyun Cheng; Dazhu Chen; Pingsheng He; Chunlei Wang

Cure kinetics of epoxy resin/MP/anhydride/accelerant flame retardant composite

Yiyun Cheng, Dazhu Chen, Pingsheng He, Chunlei Wang

University of Science and Technology of China

Research output: Contribution to journal › Article › peer-review

Abstract

Cure kinetics of epoxy resin E51/MP/methyltetrahydrophthalic anhydride (MeTHPA)/ 2-ethyl-4-methyl-imidazole (2,4-EMI) flame retardant composite were studied using the dynamical tortional vibration method. The influence of MP loadings on the cure behavior has been studied and the kinetic parameters such as apparent activation energy were calculated as well. The results showed that the rate of cure reactions depended distinctly on the cure temperature. At low MP loadings, the gelation time t_g for the systems did not change obviously while at higher MP loading (higher than 20 phr) t_g had a remarkable increase. Furthermore, the Flory's gelation theory and Avrami equation could be used to describe the cure behavior of epoxy composite system.

Original language	English
Pages (from-to)	48-52
Number of pages	5
Journal	Chemical Journal on Internet
Volume	5
Issue number	4
State	Published - 1 Apr 2003
Externally published	Yes

Keywords

Avrami equation
Cure kinetics
Epoxy resin
Flory's theory

Cite this

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title = "Cure kinetics of epoxy resin/MP/anhydride/accelerant flame retardant composite",

abstract = "Cure kinetics of epoxy resin E51/MP/methyltetrahydrophthalic anhydride (MeTHPA)/ 2-ethyl-4-methyl-imidazole (2,4-EMI) flame retardant composite were studied using the dynamical tortional vibration method. The influence of MP loadings on the cure behavior has been studied and the kinetic parameters such as apparent activation energy were calculated as well. The results showed that the rate of cure reactions depended distinctly on the cure temperature. At low MP loadings, the gelation time tg for the systems did not change obviously while at higher MP loading (higher than 20 phr) tg had a remarkable increase. Furthermore, the Flory's gelation theory and Avrami equation could be used to describe the cure behavior of epoxy composite system.",

keywords = "Avrami equation, Cure kinetics, Epoxy resin, Flory's theory",

author = "Yiyun Cheng and Dazhu Chen and Pingsheng He and Chunlei Wang",

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T1 - Cure kinetics of epoxy resin/MP/anhydride/accelerant flame retardant composite

AU - Cheng, Yiyun

AU - Chen, Dazhu

AU - He, Pingsheng

AU - Wang, Chunlei

PY - 2003/4/1

Y1 - 2003/4/1

N2 - Cure kinetics of epoxy resin E51/MP/methyltetrahydrophthalic anhydride (MeTHPA)/ 2-ethyl-4-methyl-imidazole (2,4-EMI) flame retardant composite were studied using the dynamical tortional vibration method. The influence of MP loadings on the cure behavior has been studied and the kinetic parameters such as apparent activation energy were calculated as well. The results showed that the rate of cure reactions depended distinctly on the cure temperature. At low MP loadings, the gelation time tg for the systems did not change obviously while at higher MP loading (higher than 20 phr) tg had a remarkable increase. Furthermore, the Flory's gelation theory and Avrami equation could be used to describe the cure behavior of epoxy composite system.

AB - Cure kinetics of epoxy resin E51/MP/methyltetrahydrophthalic anhydride (MeTHPA)/ 2-ethyl-4-methyl-imidazole (2,4-EMI) flame retardant composite were studied using the dynamical tortional vibration method. The influence of MP loadings on the cure behavior has been studied and the kinetic parameters such as apparent activation energy were calculated as well. The results showed that the rate of cure reactions depended distinctly on the cure temperature. At low MP loadings, the gelation time tg for the systems did not change obviously while at higher MP loading (higher than 20 phr) tg had a remarkable increase. Furthermore, the Flory's gelation theory and Avrami equation could be used to describe the cure behavior of epoxy composite system.

KW - Avrami equation

KW - Cure kinetics

KW - Epoxy resin

KW - Flory's theory

UR - https://www.scopus.com/pages/publications/3042791095

M3 - 文章

AN - SCOPUS:3042791095

SN - 1523-1623

VL - 5

SP - 48

EP - 52

JO - Chemical Journal on Internet

JF - Chemical Journal on Internet

IS - 4

ER -

Cure kinetics of epoxy resin/MP/anhydride/accelerant flame retardant composite

Abstract

Keywords

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