TY - JOUR
T1 - Corrigendum to “A subgap density of states modeling for the transient characteristics in oxide-based thin-film transistors” [Microelectron. Reliab. 60 (2016) 67–69](S0026271415302535)(10.1016/j.microrel.2015.12.007)
AU - Wang, Weiliang
AU - Khan, Karim
AU - Zhang, Xingye
AU - Qin, Haiming
AU - Jiang, Jun
AU - Miao, Lijing
AU - Jiang, Kemin
AU - Wang, Pengjun
AU - Dai, Mingzhi
AU - Chu, Junhao
N1 - Publisher Copyright:
© 2016
PY - 2016/12/1
Y1 - 2016/12/1
N2 - The authors wish to update < Authors of article: Weiliang Wanga,b, Karim Khanb, Xingye Zhangc, Haiming Qinb, Jun Jiangb, Lijing Miaob, Kemin Jiangb, Pengjun Wanga⁎, Mingzhi Daib⁎, Junhao Chud⁎ (⁎ Means corresponding authors.) Affiliations of authors: a. Institute of Circuits and Systems, Ningbo University, Ningbo 315211, China b. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China c. Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, China d. Laboratory of Polar Materials and Devices, Ministry of Education, East China Normal University, 500 Dong-chuan Road, Shanghai 200241, China >. The authors would like to apologise for any inconvenience caused.
AB - The authors wish to update < Authors of article: Weiliang Wanga,b, Karim Khanb, Xingye Zhangc, Haiming Qinb, Jun Jiangb, Lijing Miaob, Kemin Jiangb, Pengjun Wanga⁎, Mingzhi Daib⁎, Junhao Chud⁎ (⁎ Means corresponding authors.) Affiliations of authors: a. Institute of Circuits and Systems, Ningbo University, Ningbo 315211, China b. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China c. Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, China d. Laboratory of Polar Materials and Devices, Ministry of Education, East China Normal University, 500 Dong-chuan Road, Shanghai 200241, China >. The authors would like to apologise for any inconvenience caused.
UR - https://www.scopus.com/pages/publications/85006274150
U2 - 10.1016/j.microrel.2016.09.003
DO - 10.1016/j.microrel.2016.09.003
M3 - 评论/辩论
AN - SCOPUS:85006274150
SN - 0026-2714
VL - 67
SP - 159
JO - Microelectronics Reliability
JF - Microelectronics Reliability
ER -