TY - JOUR
T1 - Co-Optimization Between Static and Switching Characteristics of LDMOS With p-Type Trapezoidal Gate Embedded in Drift Region
AU - Shi, Zhangjun
AU - Li, Xiaojin
AU - Sun, Yabin
AU - Zhang, Bo
AU - Shi, Yanling
N1 - Publisher Copyright:
© 2022 Institute of Electrical and Electronics Engineers Inc.. All rights reserved.
PY - 2022/8/1
Y1 - 2022/8/1
N2 - — In this article, a novel p-type trapezoidal gate (PTG) lateral double-diffused MOSFET (LDMOS) is proposed and investigated by the 3-D TCAD simulation. The results reveal that the PTG LDMOS boasts a reduced gate-to-drain charge (QGD) while maintaining an acceptable breakdown voltage (BV) and specific ON-resistance (RONsp). Compared with conventional LDMOS, a better tradeoff between the static figure of merit (FOMS, FOMS = BV2/RONsp) and the dynamic figure of merit (FOMD, FOMD = RONsp · QGD) is realized. In the ON-state, the p-type polysilicon gate embedded in the drift region induces multiple plane majority-carrier accumulation layers, leading to a decrease in RONsp. In the OFF-state, the metal–insulator–semiconductor (MIS) capacitor, which is composed of extended trench gate, gradual trapezoidal oxide, and N-drift. assists in depleting the drift region. Therefore, the doping concentration of drift region can be significantly lifted, and the BV is increased. Besides, the p-n junction capacitor composed of p-type and n-type polysilicon isolates the field coupling between gate and drain, and the gate-to-drain capacitor (CGD) is thus reduced. Compared with multiple-plane electron accumulation layer LDMOS (MAL LDMOS) and split triple-gate LDMOS (STG-LDMOS), QGD and RONsp of our proposed PTG LDMOS are shrunk by 34.3% and 54.4%, respectively. In general, the proposed PTG LDMOS achieves a better tradeoff between the static and switching characteristics.
AB - — In this article, a novel p-type trapezoidal gate (PTG) lateral double-diffused MOSFET (LDMOS) is proposed and investigated by the 3-D TCAD simulation. The results reveal that the PTG LDMOS boasts a reduced gate-to-drain charge (QGD) while maintaining an acceptable breakdown voltage (BV) and specific ON-resistance (RONsp). Compared with conventional LDMOS, a better tradeoff between the static figure of merit (FOMS, FOMS = BV2/RONsp) and the dynamic figure of merit (FOMD, FOMD = RONsp · QGD) is realized. In the ON-state, the p-type polysilicon gate embedded in the drift region induces multiple plane majority-carrier accumulation layers, leading to a decrease in RONsp. In the OFF-state, the metal–insulator–semiconductor (MIS) capacitor, which is composed of extended trench gate, gradual trapezoidal oxide, and N-drift. assists in depleting the drift region. Therefore, the doping concentration of drift region can be significantly lifted, and the BV is increased. Besides, the p-n junction capacitor composed of p-type and n-type polysilicon isolates the field coupling between gate and drain, and the gate-to-drain capacitor (CGD) is thus reduced. Compared with multiple-plane electron accumulation layer LDMOS (MAL LDMOS) and split triple-gate LDMOS (STG-LDMOS), QGD and RONsp of our proposed PTG LDMOS are shrunk by 34.3% and 54.4%, respectively. In general, the proposed PTG LDMOS achieves a better tradeoff between the static and switching characteristics.
KW - Breakdown voltage (BV)
KW - co-optimization
KW - gate–drain capacitance
KW - lateral double-diffused MOSFET (LDMOS)
KW - trapezoidal gate
UR - https://www.scopus.com/pages/publications/85132709627
U2 - 10.1109/TED.2022.3180694
DO - 10.1109/TED.2022.3180694
M3 - 文章
AN - SCOPUS:85132709627
SN - 0018-9383
VL - 69
SP - 4102
EP - 4108
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 8
ER -