An efficient technique for chip temperature optimization of multiprocessor systems in the dark silicon era

Mengquan Li, Juan Yi, Weichen Liu, Wei Zhang, Lei Yang, Edwin H.M. Sha

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

In the dark silicon era, a fundamental problem is: given a real-time computation demand represented by a set of independent applications with their own power consumption, how to determine if an on-chip multiprocessor system is able to respond to this demand and maintain its reliability by keeping every core within the safe temperature range. In this paper, we first present a novel thermal model for the prediction of chip peak temperature assuming the application-to-core mapping is determined. The mathematical model combines linearized steady-state thermal model with empirical scaling factors to achieve significantly improved accuracy and running efficiency. Based on it, a MILP-based approach is presented to find the optimal application-to-core assignment such that the computation demand is met and the chip temperature is minimized. At last, if the minimized temperature still exceeds the safe temperature threshold, a novel heuristic algorithm, called temperature threshold-aware result handling (TTRH), is proposed to drop certain applications selectively from immediate execution, and lower the chip peak temperature to the safety threshold. Extensive performance evaluation shows that the MILP-based approach can reduce the chip peak temperature by 9.1 C on average compared to traditional techniques. TTRH algorithm can further lower the chip peak temperature by 1.38° C on average with the application dropping rate of less than 4.35%.

Original languageEnglish
Title of host publicationProceedings - 2015 IEEE 17th International Conference on High Performance Computing and Communications, 2015 IEEE 7th International Symposium on Cyberspace Safety and Security and 2015 IEEE 12th International Conference on Embedded Software and Systems, HPCC-CSS-ICESS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages688-693
Number of pages6
ISBN (Electronic)9781479989362
DOIs
StatePublished - 23 Nov 2015
Externally publishedYes
Event17th IEEE International Conference on High Performance Computing and Communications, IEEE 7th International Symposium on Cyberspace Safety and Security and IEEE 12th International Conference on Embedded Software and Systems, HPCC-ICESS-CSS 2015 - New York, United States
Duration: 24 Aug 201526 Aug 2015

Publication series

NameProceedings - 2015 IEEE 17th International Conference on High Performance Computing and Communications, 2015 IEEE 7th International Symposium on Cyberspace Safety and Security and 2015 IEEE 12th International Conference on Embedded Software and Systems, HPCC-CSS-ICESS 2015

Conference

Conference17th IEEE International Conference on High Performance Computing and Communications, IEEE 7th International Symposium on Cyberspace Safety and Security and IEEE 12th International Conference on Embedded Software and Systems, HPCC-ICESS-CSS 2015
Country/TerritoryUnited States
CityNew York
Period24/08/1526/08/15

Keywords

  • Mathematical model
  • Power demand
  • Silicon
  • Temperature
  • Temperature sensors
  • Thermal resistance

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