TY - JOUR
T1 - "all-in-One" chip fabrication by 3D femtosecond laser microprocessing for biophotonics
AU - Sugioka, K.
AU - Cheng, Y.
AU - Midorikawa, K.
PY - 2007/4/1
Y1 - 2007/4/1
N2 - We developed a novel technique fabricating 3D hollow microstructures embedded in photosensitive glass. The fabrication procedure consists of the following three steps: (1) femtosecond laser direct writing, (2) thermal treatment, and (3) wet etching in a diluted HF solution. The developed technique can fabricate various microcomponents such as microfluidics, microvalve, micromirror, microsplitter, freestanding fibre, and microfluidic laser. In this paper, integration of these microcomponents in a single glass chip by a single procedure is demonstrated for all-in-one lab-on-a-chip device manufacture.
AB - We developed a novel technique fabricating 3D hollow microstructures embedded in photosensitive glass. The fabrication procedure consists of the following three steps: (1) femtosecond laser direct writing, (2) thermal treatment, and (3) wet etching in a diluted HF solution. The developed technique can fabricate various microcomponents such as microfluidics, microvalve, micromirror, microsplitter, freestanding fibre, and microfluidic laser. In this paper, integration of these microcomponents in a single glass chip by a single procedure is demonstrated for all-in-one lab-on-a-chip device manufacture.
UR - https://www.scopus.com/pages/publications/34547310491
U2 - 10.1088/1742-6596/59/1/114
DO - 10.1088/1742-6596/59/1/114
M3 - 文章
AN - SCOPUS:34547310491
SN - 1742-6588
VL - 59
SP - 533
EP - 538
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 114
ER -