Abstract
We developed a novel technique fabricating 3D hollow microstructures embedded in photosensitive glass. The fabrication procedure consists of the following three steps: (1) femtosecond laser direct writing, (2) thermal treatment, and (3) wet etching in a diluted HF solution. The developed technique can fabricate various microcomponents such as microfluidics, microvalve, micromirror, microsplitter, freestanding fibre, and microfluidic laser. In this paper, integration of these microcomponents in a single glass chip by a single procedure is demonstrated for all-in-one lab-on-a-chip device manufacture.
| Original language | English |
|---|---|
| Article number | 114 |
| Pages (from-to) | 533-538 |
| Number of pages | 6 |
| Journal | Journal of Physics: Conference Series |
| Volume | 59 |
| Issue number | 1 |
| DOIs | |
| State | Published - 1 Apr 2007 |
| Externally published | Yes |
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