Abstract
Piezoelectric micro-actuators are promising for applications in various servo control systems, with the potential to provide ultra-precision positioning and compensation. In this paper, a micro-actuator, which is configured with an "H-shaped" cavity and a pair of high aspect ratio parallel beams, was designed. The micro-actuator with the three-dimensional structure is capable of providing in-plane flexibility and out-of-plane stiffness. Appropriate material processing and batch micro-fabrication schemes were developed to produce the piezoelectric micro-actuator prototypes, involving silicon micro machining, wafer-bonding and integration of piezoelectric thin films. The performance evaluation of the micro-actuator was also conducted. The results demonstrate that a combination of silicon micro-fabrication and piezoelectric thin film deposition is a viable approach to produce miniaturized piezoelectric devices with a complex structure.
| Original language | English |
|---|---|
| Pages (from-to) | 491-496 |
| Number of pages | 6 |
| Journal | Sensors and Actuators A: Physical |
| Volume | 130-131 |
| Issue number | SPEC. ISS. |
| DOIs | |
| State | Published - 14 Aug 2006 |
| Externally published | Yes |
Keywords
- Micro-actuator
- Micro-fabrication
- Piezoelectric thin film
- Precision positioning
- Wafer-bonding
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