A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer

Xiaofeng Zhou, Lufeng Che, Jian Wu, Xiaolin Li, Yuelin Wang

Research output: Contribution to journalArticlepeer-review

30 Scopus citations

Abstract

This paper presents a novel sandwich capacitance accelerometer with a symmetrical double-sided beam-mass structure. The symmetrical beam-mass structure is fabricated from a double-device-layer silicon-on-insulate (D-SOI) wafer. The proof mass is suspended by eight beams at the corners on both sides. The beams are fabricated at the device layers of the SOI wafer; the cross-section of the beams is a standard trapezoid. The thickness of the beams can be well controlled because it is determined by the thickness of the device layer in the SOI wafer, and there is no dry etching process in the accelerometer fabrication. The resonance frequency of the developed accelerometer is measured in an open-loop system by a network analyzer. The quality factor and the resonant frequency are 18 and 812Hz, respectively. The accelerometer has an opened-loop capacitance sensitivity of 8.7pF g -1, a closed-loop sensitivity of 1.39Vg -1 and a nonlinearity of 0.49% over the range of 1 g. The measured input, referred to as the noise floor of the accelerometers, with an interface circuit is 2.4 μg (√Hz) -1(0-100Hz).

Original languageEnglish
Article number085031
JournalJournal of Micromechanics and Microengineering
Volume22
Issue number8
DOIs
StatePublished - Aug 2012
Externally publishedYes

Fingerprint

Dive into the research topics of 'A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer'. Together they form a unique fingerprint.

Cite this