A novel fabrication approach for microneedles using silicon micromaching technology

  • Xiao Wang
  • , Xiaoming Chen
  • , Zhenyin Yu
  • , Lianwei Wang*
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Scopus citations

Abstract

Optimization of drug delivery through human skin is important in modern therapy, and with the invention of painless microneedles makes it become true. This paper presents a novel fabrication process for a tapered hollow metallic needles array using nickel plating on the silicon microneedles molds. The silicon microneedles molds, with a shank height of 150-200μm and 300μm center-to-center spacing are formed, using KOH etching on Si〈100〉 wafer, and the etching rate can be easily controlled around 0.5μm/min. The finale shapes of the bottom of microneedls are regular octagon. Then through the way of nickel electroplating on the silicon microneedles, the metallic needles can be fabricated. The closed tips of needles are opened by using some mechanism polishing methods. The delivery properties of the microneedles are under investigation.

Original languageEnglish
Title of host publicationProceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS
Pages545-549
Number of pages5
DOIs
StatePublished - 2006
Event1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS - Zhuhai, China
Duration: 18 Jan 200621 Jan 2006

Publication series

NameProceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS

Conference

Conference1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS
Country/TerritoryChina
CityZhuhai
Period18/01/0621/01/06

Keywords

  • Electroplating
  • Microfabrication
  • Microneedle
  • Nickel

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