A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer

Wei Li; Xiaofeng Zhou; Jian Wu; Youling Lin; Ze Wang; Lu Feng Che

doi:10.1109/NEMS.2017.8017004

A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer

Wei Li
, Xiaofeng Zhou
, Jian Wu
, Youling Lin
, Ze Wang
, Lu Feng Che

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent performance is obtained by double-sided symmetrical folded-beams structure. The resonance frequency and quality factor are 1.3 kHz and 10, respectively. The sensitivity with closed loop interface circuit is 1.0 V/g, and the nonlinearity is 0.05% over the typical range of 1 g. The bias stability of the fabricated accelerometer is 0.2 mg.

Original language	English
Title of host publication	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	194-197
Number of pages	4
ISBN (Electronic)	9781509030590
DOIs	https://doi.org/10.1109/NEMS.2017.8017004
State	Published - 25 Aug 2017
Externally published	Yes
Event	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States Duration: 9 Apr 2017 → 12 Apr 2017

Publication series

Name	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Conference

Conference	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Country/Territory	United States
City	Los Angeles
Period	9/04/17 → 12/04/17

Keywords

capacitive accelerometer
folded-beams on single wafer
silicon-silicon bonding
symmetrical structure

Access to Document

10.1109/NEMS.2017.8017004

Cite this

Li, W., Zhou, X., Wu, J., Lin, Y., Wang, Z., & Che, L. F. (2017). A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 (pp. 194-197). Article 8017004 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2017.8017004

Li, Wei ; Zhou, Xiaofeng ; Wu, Jian et al. / A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer. 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 194-197 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017).

@inproceedings{b685693bb6634f2c8ed7d5c7a0865a11,

title = "A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer",

abstract = "We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent performance is obtained by double-sided symmetrical folded-beams structure. The resonance frequency and quality factor are 1.3 kHz and 10, respectively. The sensitivity with closed loop interface circuit is 1.0 V/g, and the nonlinearity is 0.05\% over the typical range of 1 g. The bias stability of the fabricated accelerometer is 0.2 mg.",

keywords = "capacitive accelerometer, folded-beams on single wafer, silicon-silicon bonding, symmetrical structure",

author = "Wei Li and Xiaofeng Zhou and Jian Wu and Youling Lin and Ze Wang and Che, \{Lu Feng\}",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 ; Conference date: 09-04-2017 Through 12-04-2017",

year = "2017",

month = aug,

day = "25",

doi = "10.1109/NEMS.2017.8017004",

language = "英语",

series = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "194--197",

booktitle = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",

address = "美国",

}

Li, W, Zhou, X, Wu, J, Lin, Y, Wang, Z & Che, LF 2017, A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer. in 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017., 8017004, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Institute of Electrical and Electronics Engineers Inc., pp. 194-197, 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, United States, 9/04/17. https://doi.org/10.1109/NEMS.2017.8017004

A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer. / Li, Wei; Zhou, Xiaofeng; Wu, Jian et al.
2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 194-197 8017004 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer

AU - Li, Wei

AU - Zhou, Xiaofeng

AU - Wu, Jian

AU - Lin, Youling

AU - Wang, Ze

AU - Che, Lu Feng

PY - 2017/8/25

Y1 - 2017/8/25

N2 - We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent performance is obtained by double-sided symmetrical folded-beams structure. The resonance frequency and quality factor are 1.3 kHz and 10, respectively. The sensitivity with closed loop interface circuit is 1.0 V/g, and the nonlinearity is 0.05% over the typical range of 1 g. The bias stability of the fabricated accelerometer is 0.2 mg.

AB - We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent performance is obtained by double-sided symmetrical folded-beams structure. The resonance frequency and quality factor are 1.3 kHz and 10, respectively. The sensitivity with closed loop interface circuit is 1.0 V/g, and the nonlinearity is 0.05% over the typical range of 1 g. The bias stability of the fabricated accelerometer is 0.2 mg.

KW - capacitive accelerometer

KW - folded-beams on single wafer

KW - silicon-silicon bonding

KW - symmetrical structure

UR - https://www.scopus.com/pages/publications/85030857275

U2 - 10.1109/NEMS.2017.8017004

DO - 10.1109/NEMS.2017.8017004

M3 - 会议稿件

AN - SCOPUS:85030857275

T3 - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

SP - 194

EP - 197

BT - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Y2 - 9 April 2017 through 12 April 2017

ER -

Li W, Zhou X, Wu J, Lin Y, Wang Z, Che LF. A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 194-197. 8017004. (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017). doi: 10.1109/NEMS.2017.8017004

A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer

Abstract

Publication series

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this