TY - GEN
T1 - A Lightweight Model Solution for Aluminum Material Defect Detection at the Edge
AU - Chen, Zhengzhou
AU - Liang, Jinhao
AU - Zhang, Yueling
AU - Wang, Jiangtao
AU - Zhang, Qing
AU - Xu, Gang
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Defect detection models have been widely applied in industrial edge platform. However, in the field of aluminum material defect detection still have some challenges: (i) limited availability of aluminum material defect datasets and (ii) the high computational cost associated with large-scale models. To address these challenges, we propose a novel lightweight model for aluminum material defect detection. For the first challenge, we propose Positive Sample Augmentation(PSA) to effectively increase the number of samples. Additionally, we employ model pruning, knowledge distillation and model quantization to reduce inference latency and model size. We have successfully deployed this solution on real-world industrial platforms, double the running speed and reduce approximately 75% hardware costs, thereby validating the feasibility of our approach.
AB - Defect detection models have been widely applied in industrial edge platform. However, in the field of aluminum material defect detection still have some challenges: (i) limited availability of aluminum material defect datasets and (ii) the high computational cost associated with large-scale models. To address these challenges, we propose a novel lightweight model for aluminum material defect detection. For the first challenge, we propose Positive Sample Augmentation(PSA) to effectively increase the number of samples. Additionally, we employ model pruning, knowledge distillation and model quantization to reduce inference latency and model size. We have successfully deployed this solution on real-world industrial platforms, double the running speed and reduce approximately 75% hardware costs, thereby validating the feasibility of our approach.
KW - Data Augmentation
KW - Defect Detection
KW - Knowledge Distillation
KW - Lightweight Model
KW - Model Pruning
UR - https://www.scopus.com/pages/publications/85214815950
U2 - 10.1109/SIES62473.2024.10768079
DO - 10.1109/SIES62473.2024.10768079
M3 - 会议稿件
AN - SCOPUS:85214815950
T3 - 2024 IEEE 14th International Symposium on Industrial Embedded Systems, SIES 2024
SP - 164
EP - 171
BT - 2024 IEEE 14th International Symposium on Industrial Embedded Systems, SIES 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th IEEE International Symposium on Industrial Embedded Systems, SIES 2024
Y2 - 23 October 2024 through 25 October 2024
ER -