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A ferroelectric fin diode for robust non-volatile memory

*Corresponding author for this work
  • East China Normal University
  • Zhejiang Lab
  • Fudan University
  • Central South University
  • Shanghai Jiao Tong University
  • Université Paris-Saclay
  • Shanxi University

Research output: Contribution to journalArticlepeer-review

Abstract

Among today’s nonvolatile memories, ferroelectric-based capacitors, tunnel junctions and field-effect transistors (FET) are already industrially integrated and/or intensively investigated to improve their performances. Concurrently, because of the tremendous development of artificial intelligence and big-data issues, there is an urgent need to realize high-density crossbar arrays, a prerequisite for the future of memories and emerging computing algorithms. Here, a two-terminal ferroelectric fin diode (FFD) in which a ferroelectric capacitor and a fin-like semiconductor channel are combined to share both top and bottom electrodes is designed. Such a device not only shows both digital and analog memory functionalities but is also robust and universal as it works using two very different ferroelectric materials. When compared to all current nonvolatile memories, it cumulatively demonstrates an endurance up to 1010 cycles, an ON/OFF ratio of ~102, a feature size of 30 nm, an operating energy of ~20 fJ and an operation speed of 100 ns. Beyond these superior performances, the simple two-terminal structure and their self-rectifying ratio of ~ 104 permit to consider them as new electronic building blocks for designing passive crossbar arrays which are crucial for the future in-memory computing.

Original languageEnglish
Article number513
JournalNature Communications
Volume15
Issue number1
DOIs
StatePublished - Dec 2024

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