@inproceedings{c3915ba1bb0245d081e90cf551bdd34f,
title = "A beam operated MEMS variable optical attenuator",
abstract = "The microelectromechanical variable optical attenuator (VOA) using an electrostatic beam combined with a fiber-optic collimator has designed and fabricated. This VOA is based on silicon-on-insulator (SOI). When the driving voltage is applied to the beam and the substrate, the beam will yield a vertical displacement. Then the reflected light can't enter into the coupled fiber completely. Based on electrostatic actuation, the attenuation level is adjusted by changing the displacement of the beam. The relationship between the voltage and the displacement was analyzed by using ANSYS, a finite element analysis software package. The result of the simulation shows that the attenuator with the new structure has good performances. The fabrication steps use two wet etching processes. The active layer of SOI wafer is first patterned into the mirror sharp by TMAH, and the backside is etched to the buried oxide (BOX) using a 2-μm-thick SiO2 mask. After releasing the structure in hydrofluoric acid, gold layers are deposited by vacuum evaporation. The testing is still in progress.",
keywords = "Micro-electromechanical Systems (MEMS), Silicon on insulator (SOI), Variable optical attenuator (VOA)",
author = "Shuqin Ding and Xiaodong Zhang and Xiaoming Chen and Lianwei Wang",
year = "2008",
doi = "10.1117/12.792241",
language = "英语",
isbn = "9780819471826",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Sixth International Conference on Thin Film Physics and Applications",
note = "6th International Conference on Thin Film Physics and Applications, TFPA 2007 ; Conference date: 25-09-2007 Through 28-09-2007",
}