22.6 A 13-Channel 1.53-mW 11.28-mm2 Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction

Boxiao Liu; Guoxing Wang; Yongfu Li; Hui Li; Yue Gao; Lei Zeng; Yixin Ma; Yong Lian; Chun Huat Heng

doi:10.1109/ISSCC.2019.8662352

22.6 A 13-Channel 1.53-mW 11.28-mm² Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction

Boxiao Liu
, Guoxing Wang
, Yongfu Li
, Hui Li
, Yue Gao
, Lei Zeng
, Yixin Ma
, Yong Lian
, Chun Huat Heng

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

26 Scopus citations

Abstract

Electrical-impedance tomography (EIT) has been reported as the only viable wearable real-time method for lung imaging [1]. Previous EIT chips generally employ Time-Division Multiplexing (TDM) or as active electrode to facilitate multi-channel read-out [2]-[4], and support a large number of electrodes by sharing a maximum of 6 parallel readout channels per chip. In this paper, we present an EIT-SoC with the following features: 1) early demodulation to relax the bandwidth requirement of the analog front-end, and minimize the impact of motion artifact and DC offset generated at the skin-electrode interface; 2) Frequency-Division Multiplexing (FDM) to combine 13 pairs of I/Q signals into 2 data streams for quantization by 2 δ σ Modulators (DSMs); 3) throughput reduction at a compression ratio of 9.75:1; 4) an inverted 'V-shape' gain configuration to minimize voltage variations across all channels; and 5) batch spectrum processing for data from all channels with no digital filtering.

Original language	English
Title of host publication	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	370-372
Number of pages	3
ISBN (Electronic)	9781538685310
DOIs	https://doi.org/10.1109/ISSCC.2019.8662352
State	Published - 6 Mar 2019
Externally published	Yes
Event	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 - San Francisco, United States Duration: 17 Feb 2019 → 21 Feb 2019

Publication series

Name	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume	2019-February
ISSN (Print)	0193-6530

Conference

Conference	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Country/Territory	United States
City	San Francisco
Period	17/02/19 → 21/02/19

Access to Document

10.1109/ISSCC.2019.8662352

Cite this

Liu, B., Wang, G., Li, Y., Li, H., Gao, Y., Zeng, L., Ma, Y., Lian, Y., & Heng, C. H. (2019). 22.6 A 13-Channel 1.53-mW 11.28-mm² Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 (pp. 370-372). Article 8662352 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2019.8662352

Liu, Boxiao ; Wang, Guoxing ; Li, Yongfu et al. / 22.6 A 13-Channel 1.53-mW 11.28-mm² Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction. 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 370-372 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

@inproceedings{f80e7b8e88e24f5d8d9f3fc9fd02c31c,

title = "22.6 A 13-Channel 1.53-mW 11.28-mm2 Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction",

abstract = "Electrical-impedance tomography (EIT) has been reported as the only viable wearable real-time method for lung imaging [1]. Previous EIT chips generally employ Time-Division Multiplexing (TDM) or as active electrode to facilitate multi-channel read-out [2]-[4], and support a large number of electrodes by sharing a maximum of 6 parallel readout channels per chip. In this paper, we present an EIT-SoC with the following features: 1) early demodulation to relax the bandwidth requirement of the analog front-end, and minimize the impact of motion artifact and DC offset generated at the skin-electrode interface; 2) Frequency-Division Multiplexing (FDM) to combine 13 pairs of I/Q signals into 2 data streams for quantization by 2 δ σ Modulators (DSMs); 3) throughput reduction at a compression ratio of 9.75:1; 4) an inverted 'V-shape' gain configuration to minimize voltage variations across all channels; and 5) batch spectrum processing for data from all channels with no digital filtering.",

author = "Boxiao Liu and Guoxing Wang and Yongfu Li and Hui Li and Yue Gao and Lei Zeng and Yixin Ma and Yong Lian and Heng, \{Chun Huat\}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 ; Conference date: 17-02-2019 Through 21-02-2019",

year = "2019",

month = mar,

day = "6",

doi = "10.1109/ISSCC.2019.8662352",

language = "英语",

series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Liu, B, Wang, G, Li, Y, Li, H, Gao, Y, Zeng, L, Ma, Y, Lian, Y & Heng, CH 2019, 22.6 A 13-Channel 1.53-mW 11.28-mm² Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction. in 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019., 8662352, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 2019-February, Institute of Electrical and Electronics Engineers Inc., pp. 370-372, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, San Francisco, United States, 17/02/19. https://doi.org/10.1109/ISSCC.2019.8662352

22.6 A 13-Channel 1.53-mW 11.28-mm² Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction. / Liu, Boxiao; Wang, Guoxing; Li, Yongfu et al.
2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 370-372 8662352 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Li, Yongfu

AU - Li, Hui

AU - Gao, Yue

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AU - Heng, Chun Huat

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AB - Electrical-impedance tomography (EIT) has been reported as the only viable wearable real-time method for lung imaging [1]. Previous EIT chips generally employ Time-Division Multiplexing (TDM) or as active electrode to facilitate multi-channel read-out [2]-[4], and support a large number of electrodes by sharing a maximum of 6 parallel readout channels per chip. In this paper, we present an EIT-SoC with the following features: 1) early demodulation to relax the bandwidth requirement of the analog front-end, and minimize the impact of motion artifact and DC offset generated at the skin-electrode interface; 2) Frequency-Division Multiplexing (FDM) to combine 13 pairs of I/Q signals into 2 data streams for quantization by 2 δ σ Modulators (DSMs); 3) throughput reduction at a compression ratio of 9.75:1; 4) an inverted 'V-shape' gain configuration to minimize voltage variations across all channels; and 5) batch spectrum processing for data from all channels with no digital filtering.

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ER -

Liu B, Wang G, Li Y, Li H, Gao Y, Zeng L et al. 22.6 A 13-Channel 1.53-mW 11.28-mm² Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 370-372. 8662352. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). doi: 10.1109/ISSCC.2019.8662352