105× Endurance Improvement of FE-HZO by an Innovative Rejuvenation Method for 1z Node NV-DRAM Applications

Tiancheng Gong, Lei Tao, Junkang Li, Yan Cheng, Yannan Xu, Wei Wei, Pengfei Jiang, Peng Yuan, Yuan Wang, Yuting Chen, Yaxin Ding, Yang Yang, Yan Wang, Bing Chen, Qing Luo, Steve S. Chung, Shixuan Du, Ming Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

32 Scopus citations

Abstract

High operating voltage and low endurance are obstacles for FE HZO to be a viable candidate for NV-DRAM technology. In this work, we provide a breakthrough solution for HZO towards 1z node NV-DRAM application. Firstly, the endurance failure mechanism of HZO film under low-electric field (<1.5MV/cm) is systematically investigated by electrical characterizations, DFT calculations and STEM-ABF technique. It is found that fatigue under low-electric field is relevant to the electron de-trapping rather than defect generation. Furthermore, based on the new insight on the failure mechanism, a novel rejuvenation method is proposed. Five orders of endurance enhancement can be achieved. The excellent properties including low operating voltage (1.1V), non-volatile and fairly high endurance (>1014) are quite promising towards 1z node NV-DRAM applications.

Original languageEnglish
Title of host publication2021 Symposium on VLSI Technology, VLSI Technology 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9784863487802
StatePublished - 2021
Event41st Symposium on VLSI Technology, VLSI Technology 2021 - Virtual, Online, Japan
Duration: 13 Jun 202119 Jun 2021

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2021-June
ISSN (Print)0743-1562

Conference

Conference41st Symposium on VLSI Technology, VLSI Technology 2021
Country/TerritoryJapan
CityVirtual, Online
Period13/06/2119/06/21

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