玻璃表面嵌入式亚微米金属线的制备

In this study, a method for fabricating embedded submicron metal wires on glass surfaces is demonstrated. First, grooves with submicron linewidths were ablated on glass surfaces using femtosecond laser direct writing. Then, metal films were deposited on the laser-treated glass surfaces using continuous-flow electroless plating. Subsequently, the plated samples were annealed by a thermal treatment process. Finally, an additional mechanical polishing process enabled the controllable fabrication of the embedded submicron metal wires on the glass surfaces. By combining the threshold effects of femtosecond laser ablation and continuous-flow electroless plating, metallic silver lines with a minimum linewidth of approximately 0.66 μm can be prepared. Moreover, four-probe measurement results indicate that the resistivity of the fabricated submicron metal wires is only approximately 1.2 higher than that of bulk silver, thus indicating their good electrical conductivity.