中国对外技术转移网络的空间演化及其影响因素

Translated title of the contribution: Spatial evolution and influential factors of China's foreign technology transfer network

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The rapid development of technology stimulates prosperity of patent transfer worldwide. This article aims to explore the spatial evolution, and influencing factors of the patent transfer of the mainland China. The approaches of the spatial analysis, complex network analysis, and negative binomial regression analysis were involved. It is found that: (1)The patent transfer network between China and other countries or regions is becoming denser, and the patent transfers between the Chinese mainland and other countries and regions show significant spatial heterogeneity at the global scale. Europe and America, who traditionally dominated the international technical exchanges for quite a long time, have gradually been replaced by three pillars of the world, e. g., Europe, North America, and East Asia. (2)Three domestic hubs are observed in the patent transfer flow network, which are Taiwan, Hong Kong, the Chinese mainland. The Chinese mainland has gradually become the largest core of the network. The scale of patent introduction has always been larger than patent dissemination. Taiwan plays an important role in patent output, while Hong Kong acts as a technical intermediary. (3) Transnational patent transfer will benefit from increasing research and development (R&D) investment and high-tech product exports as they help fill technological gaps. The accessibility of the contact channels and development degree of national economy are positively related to the quantity of patent transfer,but the influence of geographic proximity is not significant.

Translated title of the contributionSpatial evolution and influential factors of China's foreign technology transfer network
Original languageChinese (Traditional)
Pages (from-to)19-30
Number of pages12
JournalWorld Regional Studies
Volume32
Issue number1
DOIs
StatePublished - 1 Jan 2023

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