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Dive into the research topics where Jiongyou Jin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Intra-metal leakage reliability characteristics for line/via in copper/low-k interconnect structures
Kim, J. W., Lee, N. H., Kim, H. W., Kim, H. S. & Rim, C. B., 2002, 2002 IEEE International Integrated Reliability Workshop Final Report, IRW 2002. Institute of Electrical and Electronics Engineers Inc., p. 36-40 5 p. 1194229. (IEEE International Integrated Reliability Workshop Final Report; vol. 2002-January).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A robust and fast OPC approach for metal interconnects of 0.13 um logic devices
Park, J. S., Kim, D. H., Park, C. H., Kim, Y. H., Yoo, M. H., Kong, J. T., Kim, H. W. & Yoo, S. I., 2001, In: Proceedings of SPIE - The International Society for Optical Engineering. 4562 II, p. 1104-1111 8 p.Research output: Contribution to journal › Conference article › peer-review
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An efficient rule-based OPC approach using a DRC tool for 0.18μm ASIC
Park, J. S., Park, C. H., Rhie, S. U., Kim, Y. H., Yoo, M. H., Kong, J. T., Kim, H. W. & Yoo, S. I., 2000, Proceedings of the IEEE 2000 1st International Symposium on Quality Electronic Design, ISQED 2000. IEEE Computer Society, p. 81-85 5 p. 838858. (Proceedings - International Symposium on Quality Electronic Design, ISQED; vol. 2000-January).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
44 Link opens in a new tab Scopus citations